6 Cores, 12 Threads, 12 MB cache, ECC support
6 Cores, 12 Threads, 9 MB cache
4 Cores, 8 Threads, 8 MB cache
4 Cores, 4 Threads, 6 MB cache, ECC support
2 Cores, 2 Threads, 2 MB cache, ECC support
CPU frequency is preset to match cooling capacity and target case temperature.
Owner can adjust this setting in BIOS.
Up to 64 GB DDR4-2400 ECC | non-ECC
2x SODIMM DDR4-2400 ECC | Non-ECC (unbuffered)
Graphics & display
Integrated Intel UHD Graphics P630 / 630 / 610
Up to 3x DisplayPort 1.2 – 4K @ 60 Hz | HDMI 1.4 – 4K @ 30 Hz
Specific types of ports depends on selected TELs.
Native I/O buses and interfaces
Up to 38 PCIe 3.0 lanes (25 ports)
Up to 5x USB 3.1 gen 2
Up to 8x SATA 3
SATA ports are multiplexed with PCIe
Some USB 3.1 ports are multiplexed with PCIe
USB 3.1 gen 2 functionality depends on compatible TELs. Some TELs support only USB 3.1 gen
NVMe M.2 2280
Up to 8 NVMe devices can be installed, each with PCIe 3 x4 interface
Up to 2 SATA devices can be installed, (M.2 key-M 2280 | 2260 | 2242)
Up to 2 mSATA devices can be installed
-- Under development --
Up to 3x 4K displays - DisplayPort 1.2 4096x2304 @ 60Hz - HDMI 1.4 4096x2160 @ 30Hz
Up to 4x USB 3.1 gen 1 Over 40 ports of USB 2 can be installed USB power in S5 can be configured per port
3.5mm jacks. Headphones out + mic. in using TI PCM2912A Codec. Multiple audio ports can be installed.
Using DB9 connector. Each port supports RS232, RS485 half/full duplex and can be configured independently. Over 20 ports can be installed.
Using DB9 connector Supports CAN 2.0A Specifications and ISO 11898-2 Bit rate of up to 1Mbit/s DIP switch for enabling/disabling on-board 120 Ohm termination Isolation per UL 1577, transient immunity: 30kV/uS, isolated DC 5V power CANbus is driven by a dedicated 32bit microcontroller (ARM Cortex M0 - STM32F042C6) running open source firmware that can be upgraded Driverless operation in Windows USB native device in Linux Over 10 ports can be installed
Unidirectional Isolation block, isolation per UL 1577 GPIOs are driven by a dedicated 32bit microcontroller (ARM Cortex M0 - STM32F072CB) running open source firmware that can be upgraded Each GPIO can be configured as input/output in software Terminal block connector 3.3V / 5V level can be selected by a DIP switch Over 100 GPIO ports can be installed
Using Intel i210, each port is on an independent PCIe port. Using RJ45 ports. 20 ports can be installed.
Gbit Ethernet with PoE source (PSE)
POE+ 802.3at 30W per port. Using Intel i210, each port is on an independent PCIe port. Using RJ45 ports. 12 ports can be installed
Universal LTE cat 12 (SIMCOM SIM7912G-M2) by default. Other M.2 key-B or mini-PCIe modems can be installed. Each modem-TEL has a SIM card tray optionally accessible from the outside. Number of antennas as required by modems can be installed. Antennas can be positioned anywhere on the computer's perimeter. Up to 9 LTE modems can be installed.
Wi-Fi 6 (Intel AX200) by default. Buyer can install another Wi-Fi adapter. Number of Wi-Fi antennas as required by Wi-Fi module. Antennas can be positioned anywhere on the computer's perimeter. Up to 9 Wi-Fi adapters can be installed.
Bluetooth 5.1 (Intel AX200) by default. Bluetooth is normally an added feature in a Wi-Fi adapter. Buyer can install another adapter. Up to 9 adapters can be installed.
M.2 key E
Up to 9 M.2 key-E devices can be installed
M.2 key B
Up to 9 M.2 key-B devices can be installed. Each has a SIM card tray optionally accessible from the outside.
M.2 key M
M.2 key-M devices up to M.2 2280 devices, PCIe x4 Each device has Integrated cooling Up to 8 M.2 key-M devices can be installed
Mini PCI Express
Up to 9 mini PCI express devices can be installed. Each has a SIM card tray optionally accessible from the outside.
-- under development --
Security, reliability & manageability features
Optional Trusted Platform Module 2.0 (TPM 2.0)
Infineon SLM 9670AQ2.0
Features: TPM 2.0, RSA-2048, ECC-256, SHA-256, EAL4+
Auto-detection of connected TELs and auto re-configuration
TELs are identified during power-up
TRIP mode is adjusted to comply with specific TEL requirements (e.g. 4x PCIe x1 / 1x PCIe x4 / SATA / USB3)
If TEL is incompatible to TRIP capabilities, TEL is automatically disabled
Configuration control and reporting
In BIOS, TRIPs and connected TELs can be listed
For each TEL, revision, serial number and specific information (e.g. MAC address) can be displayed
TEL connected to each TRIP can be enabled on detection, disabled, or unconditionally enabled
Configurable CPU TDP
Maximum power of the CPU can be adjusted in BIOS to match:
Cooling capacity of the enclosure
Target operating temperature
Optional out-of-band management
Optional supervisor micro-controller featuring
Powering up / powering down the system
On power resume, system powers on and boots.
BIOS & OS
AMI Aptio V
Windows 10 Professional | Linux Mint
Compatible with other Windows 10 variants.
Compatible with other Linux variants.
Compatible with other hypervisors and operating systems (e.g. ESXi, FreeBSD)
Tensor elements (TELs)
Name Description Max units Stacking
TEL-NVME M.2 2280 NVMe card or M.2 SATA 8 A C
TEL-MSATA mSATA card 2
TEL-SATAX11x 2.5" SSD / HDD
PM-12VA miniature 12V power module with polarity, overvoltage protection and twist-lock jack
PM-WIDEA regulating wide-input voltage, high current power
PM-BALANCERA power load-balancer between two inputs for power
TEL-HDMIMINIDPHDMI + mini Display Port, designed for TRIP-M
TEL-DPHDMIDisplay Port + HDMI, designed for TRIP-M
TEL-STDDisplay Port + Gbit Ethernet on a single compact TEL, designed for TRIP-S
TEL-USB3X4V4x USB3 type A vertical connectors, designed for TRIP-U
TEL-USB2X4V4x USB2 type A vertical connectors
Other I/O TELs
TEL-AUDIOHeadphones / line-out + microphone using 2x 3.5mm
TEL-SERX44x RS232 / RS485 with DB9 connectors
TEL-CANBUSCANbus interface using DB9 connector
TEL-GPIOUp to 20 isolated general purpose I/Os using terminal
TEL-LANX22x Gbit Ethernet ports using RJ45 connectors
TEL-LANX44x Gbit Ethernet ports using RJ45 connectors
TEL-POEX22x Gbit Ethernet with PSE PoE (POE+ 802.3at, 30W per port) using RJ45 connectors
C, A (W30)
TEL-OPLNX22x fiber optics Gbit Ethernet using SFP+ sockets
C, A (W30)
TEL-M2EM.2 key-E socket
TEL-M2BM.2 key-B socket with a panel mounted tray for SIM card
TEL-MINIPCIEmini-PCIe socket with a panel mounted tray for SIM card
Tensor-PC I20A is offered in 18 different enclosure variants –
3 compartment heights
3 types of cooling ribs
20 cm (option W20)
30 cm (option W30)
2.5 cm – stacking A (option H25A)
3.5 cm – stacking C (option H35C)
4.9 cm – stacking A+C (option H49AC)
Flat with no ribs (option C0)
1 cm ribs (option CR10)
2 cm ribs (option CR20)
From: 20 cm (W) x 20 cm (D) x 2.5 cm (H) – 1.0 liter
To: 30 cm (W) x 20 cm (D) x 6.9 cm (H) – 4.1 liter
From: 1 Kg to 4 Kg
Dimensions depend on enclosure variant
Weight depends on enclosure variant and on configuration
All aluminum housing
VESA mounting bracket*
Wall mounting bracket*
DIN-rail mounting bracket*
* Sold separately
Input voltage range
12V – 56V*
20W – 40W
Power consumption depends on
– CPU type and TDP settings
– System load
– Installed devices
– Connected peripherals
* Input voltage range depends on the power module used.
Operating temperature range
Up to -40°C to 70°C*
5% – 95% non-condensing
* When ordered in industrial temperature range. Commercial and extended temperature range are also available.